Hong Kong Monetary Authority Launches Digital Bond Subsidy Scheme
2024-11-29 09:29:14
According to official news, the HKMA announced the launch of the "Digital Bond Funding Scheme", which originated from the 2024 Policy Address and aims to promote the development of the digital securities market and encourage the wider use of tokenization technology in the capital markets. The scheme is now open for applications for a period of three years. Eligible digital bond issuance in Hong Kong can be funded up to HK $2.50 million.
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