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According to reports, NVIDIA has contracted over 70% of TSMC's advanced packaging capacity this year

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2025-02-24 03:01:43
According to the news NVIDIA under the package TSMC Dianjin 70 advanced packaging capacitydesk3cryptocurrencydesktopCrypto News
On February 24th, according to industry news, Nvidia's latest Blackwell architecture GPU chip has seen strong demand, accounting for more than 70% of TSMC's CoWoS-L advanced packaging capacity this year. Shipments have increased by more than 20% quarter-on-quarter.
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