logodesk3
Home > Latest > Body

U.S. Department of Commerce: U.S. Chip Program announced up to $300 million in funding to promote the development of the U.S. semiconductor packaging industry.

clock
2024-11-21 18:06:30
United States Department of Commerce United States chip plan announced offer up todesk3cryptocurrencydesktopCrypto News
U.S. Department of Commerce: U.S. Chip Program announced up to $300 million in funding to promote the development of the U.S. semiconductor packaging industry.
Previous article：
14 days 12 board sunrise Oriental: The company has fully reminded that the overcharging station business has not formed business income and income, and there is no plan for large-scale promotion
Next article：
A deposit of gold prospect reserves exceeds 1,000 tons, Hunan gold limit! Company's latest response

7x24 Newsflash

Hot News

Vitalik: "DAO" means "project", "official" means "scam"Backpack Exchange已面向英国用户开放其服务派盾：NIBI同名代币发生Rug Pull，损失约31.39万美元香港金管局推出稳定币发行人沙盒CIAN与Lido合作，在Base上推出wstETH Hyper-Staking VaultGate.io 3月储备金总额突破60亿美元，额外储备金超8亿美元Polyhedra Network已于3月12日16时完成ZK空投快照英FCA：不会反对加密资产相关ETN上市请求BTC流通市值突破1.4万亿美元，续创新高Space Nation将于3月底启动OIK代币空投

Related Recommendations

Backpack Exchange已面向英国用户开放其服务派盾：NIBI同名代币发生Rug Pull，损失约31.39万美元香港金管局推出稳定币发行人沙盒CIAN与Lido合作，在Base上推出wstETH Hyper-Staking VaultGate.io 3月储备金总额突破60亿美元，额外储备金超8亿美元Polyhedra Network已于3月12日16时完成ZK空投快照英FCA：不会反对加密资产相关ETN上市请求BTC流通市值突破1.4万亿美元，续创新高Space Nation将于3月底启动OIK代币空投
logo
Sociality
twitterfacebook